The structure of aluminum printed circuit boards

Generally speaking, the PCB aluminum substrate is composed of a circuit layer, a thermally conductive insulating layer and a metal base layer; it can be divided into three layers:

Circuit layer: equivalent to the copper clad laminate of an ordinary PCB, the thickness of the circuit copper foil is 1 to 10 oz. The circuit layer (that is, copper foil) is usually etched to form a printed circuit to connect the various components of the assembly. Generally, the circuit layer requires a large current-carrying capacity, so thicker copper foil should be used, with a thickness of 35μm~ 280μm;

Insulation layer: The insulation layer is a layer of low thermal resistance thermally conductive insulating material. The thickness is 0.003 to 0.006 inches. It is generally composed of a special polymer filled with special ceramics. It has low thermal resistance, excellent viscoelasticity, thermal aging resistance, and can withstand mechanical and thermal stress. It is the core technology of aluminum-based copper clad laminates. Our aluminum printed circuit boards have obtained UL certification.

Metal base layer: The metal base layer is the support member of the aluminium pcb, which requires high thermal conductivity, generally aluminum plate will be used, copper plate can also be used (copper plate can provide better thermal conductivity), suitable for conventional machinery such as drilling, punching and cutting processing.