It can reduce the cost of PCB: When the density of PCB increases to more than eight-layer board, it is manufactured by HDI, and its cost will be lower than that of the traditional complex pressing process.
Increase circuit density: has better interconnection than that of traditional circuit boards and parts
Conducive to the use of advanced construction technology
Have better electrical performance and signal accuracy
Better reliability
Can improve thermal properties
It can improve radio frequency interference ( RFI ), electromagnetic wave interference ( EMI ), electrostatic discharge ( ESD )
Increase design efficiency
