Higher thermal conductivity
More matching thermal expansion coefficient
Stronger and lower resistance metal film
The solderability of the substrate is good, and the use temperature is high
Good insulation
Low high frequency loss
High-density assembly is possible
It does not contain organic ingredients, is resistant to cosmic rays, has high reliability in aerospace and has a long service life
The copper layer does not contain an oxide layer and can be used for a long time in a reducing atmosphere
